EPLAMID 66 GFR 35 LOV BK Q3D501

Technical Data Sheet

Material Information: Polyamide 66, reinforced with 35% of glass fiber, organic heat stabilized for injection moulding.
Notes : Eplamid 66 glass fiber reinforced compounds are used in electronic and electric systems applications, offering a low voltage, high dielectric strength, low conductivity and corrosion resistance.

This material is available in natural and colours on request.

EPLAMID 66 GFR 35 LOV BK Q3D501
Polyamide 66